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Contamination Control for Life Sciences and Microelectronics
July 29, 2009 | Volume 3, Issue 30 Subscribe | Advertising Services | Contact Us

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By John Durkee, Ph.D., P.E.
Group contribution methods allow one to estimate some physical and chemical properties of molecules. We do this in a screening effort when we don’t have time or resources to make measurements. Let’s review this technology and describe some recent improvements.
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PRODUCT FOCUS



Technology that Delivers: Comfort and Ease of Use.

Adhesive tapes and labels for the semiconductor, pharmaceutical, aerospace, medical, and electronics industries. Manufactured in a cleanroom manufacturing facility to assure particle-free and residue-free adhesive tapes and labels to meet the specifications for critical applications. The wide variety of tape includes substrates such as polyester, polyethylene, PVC, polypropylene, Kapton®, and polyimide.
www.cleanroomtape.com
CLEANROOM TIP OF THE WEEK

Basic Cleanroom Protocol, Part 1
 Most basic protocol programs for cleanrooms are based on the IEST recommended practices for contamination control and the ISO 14644 series of international standards for cleanrooms and associated controlled environments. The focus of any protocol program is to protect the integrity of the cleanroom and the products and processes in the cleanroom from the people working in the cleanroom.
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MANAGEMENT TIP OF THE WEEK

Hard Work Can Propel You to the Top
There's never been a tougher time to be a part of the job market, and people are scrambling to show employers they have what it takes. The secret to success may be simpler than you thought: hard work.
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INDUSTRY NEWS
  • Registration Open, Stimulus Discount Available for IEST Fall Conference Tutorials
    The IEST Fall Conference, which will be held November 9–12, 2009, at the Doubletree Hotel Chicago-Arlington Heights in Arlington Heights, Illinois, offers five tutorials and a training stimulus discount.
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  • Entegris Launches New Technologies for Advanced Wafer Environment Control
    Entegris, Inc. announced several new enhancements to its Spectra line of Front Opening Unified Pods, carriers used to transport 300mm wafers in a fab.
    read more

  • Free Guide to Using Small Assembly Robots in Upstream Packaging Processes Available
    DENSO Robotics announced publication of a new free guide for manufacturers, packaging engineers, machine builders, and system integrators, “Packaging Automation Trends: Using Small Assembly Robots in Upstream Packaging Processes.”
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  • High-Tech Conversions Moves to New Facility
    High-Tech Conversions has moved to a larger corporate headquarters that will quadruple the size of its former facility.
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Industry Calendar

August 24-26, 2009
Active Pharmaceutical Ingredient (API) and Drug Product Specification
Costa Mesa, CA

Aug 30 - Sep 4, 2009
EOS/ESD Symposium
Anaheim, CA

September 2-4, 2009
Technical Writing for the Pharmaceutical, Medical Device, and Biotech Industries
Costa Mesa, CA

September 9-11, 2009
SEMICON Taiwan
Taipei, Taiwan

see more events
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