Fab 15 will be TSMC’s third Gigafab™, or fab with capacity of more than 100,000 12-inch wafers per month, and will also be TSMC’s second Gigafab™ equipped for 28nm technology. Construction will be divided into four phases, and total investment over the next several years is expected to exceed NT$300 billion. TSMC is scheduled to begin equipment move-in for the Phase 1 facility in June 2011, with volume production of 40nm and 28nm technology products for customers in the first quarter of 2012. More advanced process nodes will be introduced as TSMC’s technology development continues to advance.

Fab 15 will be TSMC’s next “green fab” following Fab 12 and Fab 14, incorporating green concepts in energy conservation and pollution control in its design, including a process water conservation rate of 85%, reclamation of rainwater, recirculation and reuse of general exhaust heat, and development of solar power generation and LED lighting applications. TSMC’s goal is to reach zero emissions of greenhouse gases. 

From: TSMC (Taiwan Semiconductor Manufacturing Company)