Toshiba Corporation announced a reorganization of its semiconductor production facilities in Japan that will reinforce the operating structure and profitability of the discrete, analog, and imaging IC businesses.

The reorganization will concentrate the front- and back-end production processes of six discrete semiconductor facilities into three major facilities. In parallel with this, production will be phased out at three facilities, during the first half fiscal year of 2012, which carry out front-end production of optical semiconductors and an assembly facility for power semiconductors.

Concentration of domestic production of discrete products at three major facilities will allow Toshiba to strengthen cost competitiveness and focus on higher value added products.

Source: Toshiba