February 2010 Issue Dynamic Variation of Air Change Rates
By Gordon P. Sharp
There continues to be great debate over the correct value for the minimum air change rates (ACH) for laboratories. But there is a new approach to saving energy and enhancing safety.
Purge Micro-Environment With Ionized Air to Reduce Chances of ESD Damages to Wafers
By Mike Cisewski, Huaping Wang
The problem of electrostatic discharge (ESD) resulting from charges on wafers is a serious concern in IC manufacturing processes.
Critical New Product Development
By Kathy E. Harrington, Curtis L. Harrington
There are a number of critical timing issues that new product introducers should consider as they attempt to capture intellectual property rights and facilitate early sales.
ESD Garments for Cleanrooms and Controlled Environments
By Jan Eudy
We are looking to improve our ESD control with static control garments. What are our options?
Validation Readiness, Part 2
By Barbara Kanegsberg, Ed Kanegsberg
Planning and pre-testing are keys to successful validation.
Great Clean Manufacturing Bloopers of All Time, Act 2
By John B. Durkee, Ph.D., P.E.
This is the second and final act of an article published several years ago on unforgettable clean manufacturing stories.
Point of View: Cal/OSHA Standards Board: 5 ppm PEL for n-propyl bromide
By Barbara Kanegsberg
To achieve reasonable surface quality in critical cleaning applications, manufacturers need effective cleaning options, including aggressive solvents.