Articles

Changing from Disposable to Reusable
11/01/2004

Of all of the components that comprise cleanroom operations and processes, humans are the easiest to control, yet contribute the most contamination.

MEMS, NEMS and Contamination at the Atomic Scale: Part III
11/01/2004

We conclude our discussion of NEMS and MEMS.

VOC Management: Want Cleaner Air? Go on the Atkins Diet!
11/01/2004

Check your VOCs at the door right now if you plan to do cleaning or other work in the Los Angeles basin, many countries of the EU, Japan, or perhaps even inside your own facility tomorrow.

Standing Operating Procedure: Logbooks/Sheets for Contamination Control Cleaning
10/01/2004

Let me preface this article with an explanation of my approach to the simplification of contamination control cleaning SOPs (standard operating procedures) and their associated log books/sheets.

Contamination Control in Photolithography of SAW Filter Wafers
10/01/2004

In the photolithography of surface acoustic wave (SAW) filter devices in a wafer fab, some defects are related to contamination problems in the line. Discussed here are systematic analyses that were conducted in order to increase production yield and improve product quality. Three types of contaminants are discussed: particle, atomic, and organic.

Selecting Seating For Critical Environments
10/01/2004

Seating is a primary design consideration in building or retrofitting a critical environment. Chairs and stools for cleanrooms must be engineered to guard against introducing contamination.

Case Study: Building a State-of-the-Art Nanotechnology Center
10/01/2004

Cornell University in Ithaca, New York, houses the countryís oldest federally sponsored nanotechnology centeróthe Cornell Nanoscale Science and Technology Facility (CNSTF). The center, which was built more than 20 years ago, had outgrown its existing facilities in the campus' Knight Laboratory.

MEMS, NEMS and Contamination at the Atomic Scale: Part II
10/01/2004

Last month we discussed some Micro- and Nano- Electrical-Mechanical Systems (MEMS and NEMS) with potential for greatly improved contamination sensors. This month we continue with descriptions of some of the sensing tools that are available or are under development.

Should You Care About the Difference Between Flammability and Flash Point?
10/01/2004

This column is about a concern, two misunderstandings, and possibly a misrepresentation.

Point of View
09/01/2004

Although it is imperative in the particulate/viable contaminant control process that you address every detail, both large and small, there are times when an obsession with intricacy can make you your own worst enemy with regards to inspection, certification, and oversight agencies.

HVAC Design for Multi-Product Manufacturing
09/01/2004

In the past, many biotech companies chose the traditional approach of building a dedicated facility for the purpose of manufacturing a single product. This approach has some advantages from a cGMP/regulatory compliance, staffing and production control standpoint.

Continuing Developments in Ultrasonic Technology
09/01/2004

Ultrasonics, the sound you cannot hear, has emerged as a valuable tool in achieving the cleanliness required by todayís ever-advancing technology. Disc drives, silicon wafers and chips, medical implants, and all sorts of critical hardware require ultrasonic cleaning to function properlyóor at all.

Introducing a Standard Testing Method for FFUs
09/01/2004

Cleanroom HVAC systems, especially those requiring fan filter units (FFU) for recirculating air, typically account for a large portion of energy use in cleanrooms.

Regulatory Focus
09/01/2004

The new draft ìaseptic guideline,î as it is often referred to in this industry, was initially released for industry feedback in 2002 by the Food and Drug Administration (FDA) as a concept paper.

MEMS, NEMS and Contamination at the Atomic Scale
09/01/2004

As electronic and mechanical sensors become microscopic, our world-view of contamination issues has to adjust. A few years ago, MEMS was a catchword. MEMS, or Micro-Electro-Mechanical Systems, combines mechanical elements, sensors, actuators, and electronics on a common silicon substrate.

Managing Safety with Hazard Rating Systems - Part II
09/01/2004

In today's litigious environment, the selection of cleaning chemicals and instruction for their use are not as simple as repeating what has been done before.

Point of View: Feedback on FFUs
08/01/2004

This month’s “Point of View” features three letters we received on articles that appeared in the June 2004 issue of A2C2.

Task-Specific Vented Enclosures for Personal and Product Protection
08/01/2004

Task-specific ventilated enclosures are now available for the containment of hazardous laboratory operations and materials.

Ion Mobility Theory and Applications
08/01/2004

In this article, we will investigate how this technology works, look at the various industries that use IMS monitors, and discuss monitoring applications and examples.

Garment Stitching & Qualifying a Garment Supplier
08/01/2004

What is special about stitching of cleanroom garments with respect to seam type and construction, thread selection, and other sewing parameters?

Contamination Control In and Out of the Cleanroom
08/01/2004

Hospitals in the United States must supply medical air that meets established standards for cleanliness.1 Dental offices, too, endeavor to provide clean air.

Water & Ozone - A Cleaning System, Or A Solution Looking For A Problem?
08/01/2004

Water provides three functions in critical cleaning: solvation of soils; rinsing, flushing, or displacement of undesirable liquids or solids; and conveyance of cleaning agents to where they are needed.

Advances in UV Disinfection of Air-Handling Systems
07/01/2004

Over the past decades, there has been a growing experience base in applying ultraviolet (UV) technology to disinfecting air, particularly for hospitals, food manufacturing, cleanrooms, and even office buildings to remedy the Sick Building Syndrome (SBS).

Integration of Copper R&D Processing
07/01/2004

This paper discusses the incorporation of a copper/low-K research and development line into an existing high volume production facility. The main goal of the project was to accomplish the advanced materials (including Cu and Low K) start-up with a minimal budget.

Advanced Technologies in CMP Slurry Systems Reduce Water Damage
07/01/2004

Chemical Mechanical Planarization (CMP) slurry systems have created many new challenges in the semiconductor fabrication industry. Certain types of CMP slurries consisting of suspended solids in solution are abrasive, and traditional components used in wet process systems, such as diaphragm valves, can damage these slurries.